| publications |
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>>Developing a System-Level Monitoring Instrument for UV-Curing Systems
>>Performance Comparison of MCM-D and SMT Packaging Technologies for a DSP Subsystem
>> An Overview of Placement and Routing Algorithms for Multi-Chip Modules
>>Design for Packageability: An Overview
>>Impact of Packaging Technology on System Partitioning: A Case Study
>>Early Cost/Performance Cache Analysis of Split MCM-Based MicroSparc CPU
>>Determination of an Area-Array Pitch
for Optimum MCM Systems:
A Case Study
